Bergquist GPVOUS-0.040-00-0816, Thermal Pad

Description

Thermal Conductivity: 1W/m·K

Dimensions: 200 x 100mm

Operating Temperature Range: -60 → +200 °C

Material: Gap Pad VO Ultra Soft

Thickness: 0.04in

Width: 100mm

Length: 200mm

Minimum Operating Temperature: -60°C

Material Trade Name: Gap Pad VO Ultra Soft

Maximum Operating Temperature: +200°C

Hardness: Shore OO 5

Manufacturer Standard Lead Time: 10 Weeks

Adhesive: Tacky – One Side Detailed Description: 200 x 100mm Thermal Conductivity: 1.0W/m-K Outline: 406.40mm x 203.20mm Color: Pink Series: Gap Pad® VO Material: Silicone Elastomer Shelf Life Start: Date of Manufacture Thickness: 0.0400 Shape: Rectangular Storage/Refrigeration Temperature: 77°F (25°C) Backing, Carrier: Fiberglass Shelf Life: 12 Months Type: Gap Filler Pad, Sheet Manufacturer: Bergquist

The Bergquist GPVOUS-0.040-00-0816 is a high-performance, pink-coloured interface material designed for efficient heat transfer between electronic components and heat sinks or enclosures. Measuring 406.40mm x 203.20mm in a rectangular shape, this thermal pad features a unique tacky surface on one side, ensuring a secure attachment and enhancing thermal conductivity. The material’s specialised composition allows it to conform to uneven surfaces, filling air gaps and voids that can hinder thermal performance. This thermal pad serves as a critical component in managing the thermal profiles of various electronic systems, ensuring they operate within safe temperature ranges and maintain performance integrity.

Possible Advantages of Choosing the Bergquist GPVOUS-0.040-00-0816, Thermal Pad

• The one-sided tackiness ensures the pad stays in place during assembly and maintenance.
• Its flexible nature allows it to conform to uneven surfaces and interfaces.
• The pad’s dimensions and pre-cut size make it suitable for a wide range of applications.
• By efficiently managing heat, the thermal pad contributes to the overall reliability and performance stability of electronic systems.

Optimised Thermal Conductivity

The thermal pad’s composition is engineered to facilitate efficient heat dissipation, reducing the operational temperatures of electronic components and extending their lifespan.

Application Information of the Thermal Pad

The Bergquist GPVOUS-0.040-00-0816 thermal pad finds its utility in a diverse array of applications within the electronics industry. Its design and thermal properties make it particularly suitable for:

• Power Supply Units (PSUs): Enhancing thermal management to ensure stable power delivery.
• LED Lighting Systems: Reducing heat buildup in high-intensity LED modules.
• Computing Hardware: Providing efficient heat dissipation for CPUs, GPUs, and other heat-generating components.
• Telecommunications Equipment: Managing the thermal load in routers, switches, and other networking hardware to maintain optimal performance.