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SPREADFAST HS-DC-1/2-HFL-9, Heatsink, Fits Industry Standard Brick Size DC-to-DC Modules, 62 x 60 x 10mm

Original price was: £2,57.Current price is: £0,77.

SKU: ET18253752 Categories: , Tag:

Description

Dimensions: 61 x 57.9 x 9.3mm

Application: DC-DC Converters

Series: HS

Colour: Black

Material: Aluminium

Height: 9.3mm

Width: 57.9mm

Length: 61mm

For Use With: 1/2 Brick DC/DC Converter

Special Features: Cross-Cut, Extruded, Fits Industry Standard Brick Size DC-to-DC Modules, Optimized Design for Specific Flow Required

The SPREADFAST HS-DC-1/2-HFL-9 is a state-of-the-art heatsink specifically designed to accommodate industry-standard brick-size DC-to-DC converter modules. With dimensions of 62 x 60 x 10mm, this heatsink is tailored to provide efficient thermal management for a wide array of electronic applications.

The SPREADFAST HS-DC-1/2-HFL-9, Heatsink, Fits Industry Standard Brick Size DC-to-DC Modules, 62 x 60 x 10mm: Unique Features and Benefits

  • Utilises advanced thermal management technology to effectively dissipate heat, ensuring the longevity and reliability of DC-to-DC modules.
  • Made from materials known for their thermal conductivity, they offer superior heat transfer capabilities.
  • Its small footprint makes it ideal for space-constrained applications without compromising on cooling performance.
  • Designed for simple and quick mounting, reducing setup time and complexity.
  • Compatible with a wide range of industry-standard brick-size DC-to-DC converter modules.

Design and Construction

This heatsink is crafted from high-quality materials, ensuring optimal heat dissipation and long-lasting durability. The dimensions (62mm length, 60mm width, and 10mm height) make it a perfect fit for standard brick-size modules. Its sleek and compact format allows for easy integration into various electronic setups without adding excessive bulk.

Application Versatility of the Heatsink Fits Industry Standard Brick Size DC-to-DC Modules

The SPREADFAST HS-DC-1/2-HFL-9 is a versatile and efficient solution for thermal management in a variety of electronic applications, such as:

  • Power Supply Units: Ideal for use in power supplies where efficient heat management is crucial for performance and stability.
  • Telecommunications Equipment: Ensures reliable operation of telecom hardware by maintaining optimal temperatures.
  • Industrial Electronics: Supports the thermal management needs of industrial electronic devices, contributing to enhanced durability and performance.
  • Automotive Electronics: Suitable for automotive applications where robust and efficient cooling is necessary in compact spaces.
  • Renewable Energy Systems: Enhances the reliability of renewable energy inverters and converters by effectively managing heat buildup.

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